(5/5) based on 8 customer reviews
Description
DATASHEET Nov 28, 2012 BSP322P . Parameter. Symbol Conditions. Unit min. typ. max. Thermal characteristics. Thermal resistance, junction - ambient. R thJA minimal 3. Material Content Data Sheet. Sales Product Name. BSP322P H6327. Issued. 8 . July 2016. MA#. MA001097592. Package. PG-SOT223-4-21. Weight*. BSP322P . 800m , -1.0A, LL. BSP316P. BSR316P. 1.8 , -0.68A, LL. 1.8 , -0.36 A, LL. -60. BSP612P. 120m , 3A, LL. BSP613P. BSS83P. 130m , 2.9A, NL. BSP322P . SIS468DN-T1-GE3. 1. 1%. 1%. 698K. 22K. 1%. 1%. OPEN. OPEN. 4.7 UF. MAX17599ATE+. 100. VDRV. VDRV. CMDSH-3. L2. C21. R20. R18. R6. BSP322P . 800m , -1.0A, LL. BSP316P. BSR316P. 1.8 , -0.68A, LL. 1.8 , -0.36 A, LL. -60. BSP612P. 120m , 3A, LL. BSP613P. BSS83P. 130m , 2.9A, NL.
| Part Number | BSP322P |
| Brand | Infineon Technologies AG |
| Image |  |
Hot Offer
BSP322P
Infineon Technologies A...
8000
2.0025
HK HEQING ELECTRONICS LIMITED
BSP322P H6327
INFINEON/IR
4800
2.33
ACHIEVE ELECTRONICS CO., LIMITED
BSP322P
INFIENON
56400
1.02
N&S Electronic Co., Limited
BSP322P
Infinen
11750
1.3475
Cicotex Electronics (HK) Limited
BSP322P
INFLNEON
50000
1.675
Yingxinyuan INT'L (Group) Limited
