Infineon Technologies AG

Description

DATASHEET Nov 12, 2013 Uses IRF3710 data and test conditions. **When mounted on 1 square PCB (FR- 4 or G-10 Material). For recommended footprint and soldering IRF3710 . HEXFET Power MOSFET. 09/15/09. Parameter. Typ. Max. Units. R JC. Junction-to-Case. . 0.75. R CS. Case-to-Sink, Flat, Greased Surface. 0.50. Uses IRF3710 data and test conditions. Parameter. Min. Typ. Max. Units. Conditions. IS. Continuous Source Current. MOSFET symbol. (Body Diode) . without oscillation. The current level flowing through each pass transistor. LTC4354. DB. GA. DA. GB. VSS. VB. VA. 48V_RTN. FAULT. M2. IRF3710S . M1. Electrically Equivalent to IRF3710 Add an S to the end of the part number for S-100 screening, SHD225456S Add a C to the part number for ceramic