Infineon Technologies AG

Description

DATASHEET Mar 26, 2014 LPC1114FN28 /102. DIP28. DIP28: plastic dual in-line package; 28 leads (600 mil). SOT117-1. HVQFN24/33, LQFP48, and TFBGA48 packages. LPC1111FHN33/101. HVQFN33. HVQFN: plastic thermal enhanced very thin Jun 10, 2014 LPC1112FDH20/102, LPC1112FDH28/102, LPC1114FDH28/102, LPC1114FN28 /102. SRAM use by bootloader specified in Section 26.3.1. 8. 20120308. LPC111x/LPC11C1x/LPC11C2x User manual. 7. 20110919. Nov 2, 2011 TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm. SOT361-1. LPC1114FN28 /102. DIP28. DIP28: plastic dual in-line package; 28 leads (600 mil). SOT117-1. HVQFN33 and LQFP48 packages. Sep 26, 2013 Removed LPC1110FD20, LPC1111FDH20, LPC1112FD20, LPC1112FDH20,. LPC1112FDH28, LPC1114FDH28, LPC1114FN28 ; placed in separate errata. ES_LPC1110_11_12_14. 3.2. 20120117. Added ADC.2. 3.1. Mar 5, 2012 LPC1113FHN33, LPC1113FBD48, LPC1114FDH28, LPC1114FN28 ,. LPC1114FHN33, LPC1114FHI33, LPC1114FBD48, LPC1115FBD48,. LPC1100L, LPC1100XL. Abstract. This technical note introduces the features of the